• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Flat pipe (1) with two-phase fluid-vapor working fluid, comprising a first plate (21) receiving calories from a hot source (6), a second plate (22) discharging calories to a cold source (7), a edge forming a hermetically sealed interior space, a capillary structure (3), interposed between the first and second walls, vaporization channels (11) adjacent to the first plate, condensation channels (12) adjacent to the second plate, a transfer passage (13) communicating the evaporation channels with the condensation channels for the vapor transport (5V), a collecting channel (3) forming a reservoir, in fluid communication with each condensation channel, said collecting channel being adjacent to the second plate, so that the collection channel can pump and store the excess liquid phase (5L).
    公开号:FR3027379A1
    申请号:FR1459885
    申请日:2014-10-15
    公开日:2016-04-22
    发明作者:Mikael Mohaupt；Oost Stephane Van
    申请人:Euro Heat Pipes SA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to heat pipes, and more generally to biphasic working fluid heat transfer systems. More specifically, one is interested in flat heat pipes charged with evacuating the calories produced by electronic equipment, such as a processor, a power transistor, or any other electronic component generating calories, or any other source of heat. In such a heat pipe, the working fluid is vaporized in an area called 'evaporator' and the working fluid is condensed in an area called 'condenser'. The heat pipe in question is formed by a hermetic envelope in which is enclosed a certain amount of working fluid which circulates in a closed loop between the evaporator and condenser zones thanks to the capillary phenomenon generated by a capillary structure interposed between the evaporator zone and the condenser zone. In particular, the present invention is concerned with flat heat pipes having two opposite faces, namely a first so-called 'hot' face receiving calories from the component to be cooled and a second so-called 'cold' face intended to evacuate the calories towards a radiator with fins or a conventional liquid heat exchanger. This type of heat pipe is also called "Heat Spreader" in the jargon of the trade. This type of Heat Spreader heat pipe is known for example from US Pat. No. 3,613,778, US Pat. No. 5,564,276, US Pat. No. 7,339,236 or US Pat. On the other hand, there is an increase in the surface flux density to be evacuated at the electronic component, and therefore there is a need to increase the efficiency and optimization of Heat Spreader heatpipes. The configurations of the known art do not provide an optimum solution for managing the variation in the volume of liquid as a function of the operating temperature. In fact, the volume occupied by the liquid phase increases with the operating temperature, and the excess of liquid can reduce the performance of the heat pipe, in particular at the level of heat exchanges on the condenser side, which can be masked, partly or totally , by this excess of liquid. Thus, there has been a need to improve the management of excess liquid to maintain the heat pipe performance at an optimum level over a wide range of operating temperatures. For this purpose, the subject of the invention is a flat heat pipe with two-phase liquid-vapor working fluid, comprising: a first plate, intended to receive calories from a hot source, a second plate, intended to evacuate calories to a cold source, arranged facing and substantially parallel to the first plate, - a border sealingly connecting the first and second plates, to form a closed interior space enclosing the two-phase working fluid; a capillary structure, interposed between the first and second walls, - vaporization channels adjacent to the first plate, - condensation channels adjacent to the second plate, - at least one transfer passage communicating the channels of evaporation with the condensation channels for the transport of steam, - at least one collecting channel forming a reservoir, in fluid communication with each condensation channel Said collector channel being adjacent to the second plate, so that the collector channel can attract by capillarity and store the excess liquid phase. In other words, the collecting channel acts as an expansion vessel by capturing the excess liquid so as to maintain optimum operation of the condensation channels. In various embodiments of the invention, one and / or other of the following may also be used: the vaporization channels and / or the condensation channels may be formed as grooves, either arranged in the capillary structure, or arranged on the inner face respectively of the first and second plate (s); this represents a simple geometrical configuration which can be obtained by standard manufacturing means, machining, stamping forming, etc; the collecting channel is advantageously placed in fluid communication with each condensation channel by means of a narrow / restricted passage. A suction effect is thus obtained by the formation of a meniscus and by the phenomenon of capillarity; the narrow passage is preferably arranged at the end connected to the reservoir of each condensation groove; this is an advantageous arrangement away from the slightly warmer steam inlet end; the hydraulic diameter of the narrow passage is preferably strictly smaller than the hydraulic diameter of the condensation channel; thus, the formation of a meniscus of liquid at the narrow passageway is promoted; the size of the narrow passage is preferably chosen so that the capillary pressure it generates compensates the gravity field in any direction; whereby the capillary pumping inwardly of the reservoir operates irrespective of the orientation of the heat pipe device; the mass of working fluid is advantageously chosen so that the reservoir is completely filled with the vapor phase at the minimum operating temperature of the heat pipe; this optimizes the amount of fluid required for operation over a prescribed temperature range; - The envelope formed by the first plate, the second plate and the edge is preferably made of ceramic material; material whose thermal expansion coefficient is compatible with the thermal expansion coefficients of the electronic components; which avoids the risks of mechanical stress; the capillary structure is preferably made of ceramic material; thus the thermal expansion of the capillary structure is consistent with that of the envelope; which further reduces the risks of mechanical stress. Other aspects, objects and advantages of the invention will appear on reading the following description of an embodiment of the invention, given by way of non-limiting example. The invention will also be better understood with reference to the accompanying drawings in which: FIG. 1 is a general perspective view of a heat pipe according to the invention in its environment of use, FIG. 2 is a sectional view. transverse of a heat pipe according to the invention, according to a sectional plane II-II visible in Figure 3, - Figure 3 is a horizontal sectional view of the heat pipe of Figure 2, according to a sectional plane III-III FIG. 4 shows an exploded perspective view showing the condensation side plate and the capillary structure of the heat pipe of FIG. 2; FIG. 5 is an exploded side and sectional view of the heat pipe of FIG. 2, according to a sectional plane VV visible in FIG. 3; FIG. 6 shows in greater detail the narrowed passage 5 formed between the reservoir collecting channel and a condensation channel; FIG. 7 is a view similar to FIG. Figure 5, and represents a varian The embodiment in assembled configuration. In the different figures, the same references denote identical or similar elements. FIG. 1 shows a system comprising a flat heat pipe 1 which makes it possible to evacuate calories produced by dissipative components 6 ('hot source') towards an element 7 able to receive these calories, referred to herein as the 'cold source' 7. In the example illustrated, an XY reference plane is defined. The physical interface between the dissipative components 6 and the heat pipe 1 is parallel to this reference plane as well as the physical interface between the flat heat pipe 1 and a plate belonging to the cold source 7. The flow of calories is dispersed in all the directions X, Y and H by the working fluid flowing inside the heat pipe, to be dissipated at the connection between the condenser plate 22 and the cold source 7, that is to say according to the transverse direction H perpendicular to the reference plane, but also in the X and Y directions of the reference plane. This type of flat heat pipe is also called a "Heat Spreader" because the heat evacuation surface on the side of the cold source 7 is greater than the calorie intake surface from the source (s). ) 6. Within the flat heat pipe 1 is a two-phase working fluid (i.e. comprising a liquid phase portion 5L and a vapor phase portion 5V) for withdrawing calories from the hot source 6 and discharging them towards the cold source 7. With reference to FIGS. 2 to 5, the heat pipe 1 comprises a first plate 21 intended to receive calories from the hot source, a second plate 22 to evacuate calories to the cold source 7. The second plate 22 is arranged vis-à-vis the first plate 21 and parallel to the first plate 21 at a distance in the direction H. It is noted here that the direction H does not necessarily coincide with the verti any possible gravity field, the reference plane XY does not necessarily coincide with a horizontal plane. Advantageously, the thickness of the heat pipe 1 in the direction H (between the outer faces of the first and second plates 21,22) is for example less than 20 mm, or even less than 15 mm, or even less than 10 mm; thus, the heat pipe can be easily integrated in a computer card or in an electronic control unit. However, it should be noted that the principle of the present invention can be applied with any size. In addition, a border 23 sealingly connects the first and second plates 21,22; thus, the solid walls of the first and second plates, with said border, form an enclosed interior space (sealed and sealed enclosure) enclosing the two-phase working fluid 5. Once the enclosure is sealed, there is no longer any exchange of matter between the enclosed interior space and the exterior; therefore, the amount of working fluid remains constant even though the temperature and pressure conditions vary over time. Between the first and second plates 21,22 is interposed a capillary structure 3, whose function is to suck fluid in the liquid phase and create a pressure jump capable of counter-balancing all the pressure drops of the circuit. Thus the fluid is set in motion by this capillary pump in the heat pipe. This capillary structure 3 may be formed by a porous mass (for example based on sintered metal) or by a lattice structure or iron-straw type. The capillary structure 3 can also be obtained from a porous ceramic material, or from a porous plastic material. The size of the pores is chosen as a function of the working fluid in the liquid phase and in particular of its surface tension (radius of the meniscus which is formed spontaneously). The pore size may typically be between 1 micrometers (μm) and 100 microns, or even between 1 μm and 20 μm and preferably between 2 μm and 5 μm. To facilitate the reading of the figures, the capillary structure 3 has been shown with spaced hatching, and without hatching in FIG. 3. The capillary structure 3 fills with liquid. The heat flux applied by the dissipative components 6 causes the liquid to vaporize on the surface of the capillary material which locally dries, which thus attracts the working fluid in the liquid phase and sets it in motion in the heat pipe. However, if the operating temperature of the heat pipe starts to increase due to the external conditions specific to the cooling system, it turns out that the volume occupied by the liquid phase exceeds the volume that can be accommodated inside the capillary structure. Therefore, there is an excess of liquid phase 5L which lies outside the capillary structure 3. In fact, the density pi of the liquid phase decreases when its temperature increases whereas, conversely, the mass volumic pv of the vapor phase increases. Therefore, as the overall mass of fluid in the heat pipe remains unchanged, the relative liquid volume occupied by the liquid phase 5L inside the closed enclosure of the heat pipe increases as the temperature increases which leads to an excess of liquid. An excess of liquid that would be in the condensation channels 12 would lead to degrade the heat exchange of the condensation phenomenon and a larger temperature gradient that would be detrimental. Note that the heat pipe 1 can be used in a terrestrial application where the gravity field prevails, but also in a space environment where the gravitational forces are much lower or even negligible. Due to the supply of calories at the location of the first plate 21 (i.e. evaporator side), the liquid phase working fluid 5L at this location vaporizes by absorbing these calories. Advantageously, vaporisation channels 11 are provided adjacent to the first plate to facilitate the evacuation of the vapor thus created and to allow the continuous admission of other fluid in the liquid phase. The vaporization channels 11 may be formed as illustrated as grooves in the capillary structure, but they may also be provided on the inner face of the first plate 21. The vapor 5V created on the evaporator side flows through transfer passages 13 through In this case, due to the lower temperature of the cold source, the vapor recondenses in liquid form to a condensation zone at the location of the second plate 22. In the illustrated example, this occurs in condensation channels 12 adjacent the second plate 22. In the illustrated example, the condensation channels 12 are arranged on the inner face of the second plate. In an alternative embodiment, they could be formed as grooves within the capillary structure 3. The liquid-vapor and vapor-liquid phase changes occur at a given temperature, determined by the equilibrium Psat, Tsat ( saturation conditions), and consequently, such a liquid-vapor phase change fluid heat pipe makes it possible, on the one hand, to have a very small, or even negligible, temperature difference between the first plate and the second plate, and on the other hand an almost perfect homogeneity of the temperature of the fluid inside the heat pipe and thus on the whole of the surface 27 forming the interface with the cold source 7.
    [0002] It should be noted that, ideally, the vapor does not pass through the capillary structure filled with liquid; thus, the capillary structure filled with liquid forms a barrier for the so-called 'capillary seal' vapor. In order to accommodate the excess liquid that can be formed as the operating temperature increases, it is advantageously provided according to the present invention to provide a collector channel 9 forming a reservoir, in fluid communication with each condensation channel 12. This reservoir 9 Its function is to capture any excess liquid, systematically this excess liquid eventually accumulates naturally in the condenser; the tank according to the invention attracts and captures the excess liquid as will be detailed later and thus this excess liquid does not accumulate in the condensation channels 12. In the illustrated example, the condensation channels 12 extend in the direction Y parallel to each other; the reservoir collecting duct 9 extends perpendicularly to the condensation ducts, that is to say in the direction X. In the configuration illustrated, the heat pipe has a parallelepipedal general shape, however it is not excluded to have Other geometrical arrangements, such as for example a disk or pancake configuration where the channels are arranged in a star shape or any other form making it possible to make the connection between the hot source and the cold source. Each condensation channel 12 extends between a first end 12a open towards the transfer passage 13 and a second end 12b at the location of which a fluid communication 8 is established with the reservoir collecting channel 9. The connection 8 between the collector channel 9 and each condensation channel is advantageously produced by means of a narrow passage (restricted passage) 8; more precisely, the hydraulic diameter of the narrow passage 8 is strictly smaller than the hydraulic diameter of the condensation channel 12. At this point a meniscus of liquid 84 (FIG.6) occupies the volume of the narrow passage 8. According to the fluid of FIG. selected work, the width of the narrow passage 8 may be chosen as less than three quarters of the width of the condensation groove, or less than half the width of the condensation groove, or even less than one-third.
    [0003] The reservoir 9 is bordered on its upper face by the capillary structure 3. Thus, the liquid phase can enter or leave the reservoir only through the narrow passages 8 mentioned above and / or by suction by the capillary structure.
    [0004] Furthermore, the collector channel 9 is not subjected to the steam inlet, its temperature will be slightly lower than the temperature in the condensation channels. Due to a slight differential pressure that ensues between the condensation channel and the interior of the reservoir 9, the fluid in the liquid state is sucked into the reservoir. According to an advantageous arrangement, it can be provided that the hydraulic diameter and the pressure differential that occurs are sufficient to compensate for the effects of the gravitational field irrespective of the orientation in which the heat pipe is positioned. Moreover, the orientation can be variable depending on the time if the heat pipe is embedded in a means of transport (train, plane, ...) or in a mobile device (laptop, tablet, ...).
    [0005] In the illustrated example, the transfer passage 13 serving to convey the vapor is formed by a free space which is all around the capillary structure that is to say on four sides, namely two lateral cavities 13c, 13d a posterior cavity 13b located near the reservoir is an anterior cavity 13a situated opposite the collecting channel, this anterior cavity 13a opening directly on the first ends 12a of each condensation channel. A first end 11a of each vaporization channel 11 opens into the anterior cavity 13a and a second end 11b of each vaporization channel opens into the posterior cavity 13b. The vapor flows through transfer passages are marked by the signs Fa, Fb, Fc and Fd in FIG.
    [0006] The amount of working fluid that must be contained in the closed enclosure of the heat pipe 1 is determined by the knowledge of the minimum operating temperature of the heat pipe, called T min op. Thus, the mass of fluid 5 is ideally chosen so that the liquid phase 5L occupies the entire volume of the capillary structure but not more; in other words, the mass of fluid 5 is chosen so that the reservoir 9 is completely filled with the vapor phase 5V at the minimum operating temperature T min op of the heat pipe.
    [0007] When the operating temperature of the heat pipe increases from T min op, an excess of liquid occurs and the reservoir 9 fills then. If it happens that the operating temperature of the heat pipe is less than T min op, then the capillary structure 35 is not completely filled with liquid, the tank is then completely filled with steam. In this case, the heat transfer performance of the heat pipe can be optimal but the heat pipe can operate in degraded mode (oscillations of fluid flow and / or operating temperature, or even re-increase of the latter until ironing again. above T min op). The volume of the tank 9 can be determined to admit a quantity of liquid 5L in excess which corresponds to a maximum operating temperature T max op.
    [0008] The first and second plates 21, 22 and the rim 23 may be formed of metallic material (Ni, Cu, stainless steel, ...) or of ceramic material (Al 2 O 3, AlSiC, AlN, etc.), or of plastic material. Note that the border 23 may form a separate part or may be obtained in one piece with one of the plates, for example the first plate as shown in Figure 5, the part referenced 4 including the first plate and the edge. The edge 23 is sealed by soldering, laser welding, structural bonding or the like.
    [0009] In one embodiment, the second plate, the condensation grooves and the collector channel together form a base member referenced 2. The edge could also be as a docking in the reference plane XY, with the edges of each of the plates The first plate having an offset stamped edge is shown as illustrated in FIG. 7. The working fluid used is preferably a so-called "low pressure" fluid which limits the mechanical stresses on the casing of the heat pipe. for example, water, methanol, acetone, ethanol or any refrigerant may be used. In the illustrated example, the capillary structure 3 has a parallelepipedal overall shape with a width LX3, a length LY3 is a height h3. The first plate 21 has a length LY1 substantially corresponding to the sum of LY3 plus the width of the anterior and posterior passages 12a, 12b plus the edge thickness. The second plate 22 has a width LX2, a length LY2 is a height h2. The height h7 of the condensation grooves may be identical to the height h9 of the reservoir collecting channel; but the latter may be greater than h9> h7; one can also choose h9 <h7, according to the needs and constraints of the targeted application. It should be noted that the section of the grooves can be square as illustrated, but also rectangle, triangular, semicircular, etc. With regard to the possibilities of assembling the heat pipe 15 itself or the heat pipe in its mechanical environment, it is possible to provide holes (whether open or not, threaded or not) in the first and second plates and in the capillary structure. It should be noted that the reservoir could store frozen liquid in the event of particular temperature conditions; the tank can also store non-condensable gases. The connection with the cold source is either directly established by assembly; or can be done by the addition of fins in the case of convective exchanges with an external fluid as a cold source. Note that without departing from the scope of the present invention the first and second plates 21,22 may not be parallel to each other.
    [0010] Advantageously, the system is completely passive, contains no active components, is maintenance-free, and preferably operates in any spatial orientation. For the initial filling of the heat pipe, a filling orifice and a pipe (not shown in the figures) are provided, the filling orifice being, after the introduction of the prescribed amount of working fluid, closed by a valve or by a cap or permanently sealed.5
    权利要求:
    Claims (4)
    [0001]
    REVENDICATIONS1. Flat pipe (1) with two-phase liquid-vapor working fluid, comprising: - a first plate (21) intended to receive calories from a hot source (6), a second plate (22), intended to evacuate calories to a cold source (7) arranged opposite and substantially parallel to the first plate; - a border sealingly connecting the first and second plates to form a closed interior space containing the working fluid; 2, a capillary structure (3), interposed between the first and second walls, - vaporization channels (11) adjacent to the first plate, - condensation channels (12) adjacent to the second plate, - at least one transfer passage (13) communicating the evaporation channels with the condensation channels for the vapor transport (5V), - at least one collecting channel (9) forming a reservoir, in fluid communication with each condensation channel, 25 said collector channel being adjacent to the second plate; so that the collecting channel can attract and store the excess of liquid phase (5L).
    [0002]
    2. Heat pipe according to claim 1, wherein the vaporization channels and / or the condensation channels are formed by grooves, either arranged in the capillary structure (3), or arranged on the inner face respectively of the first and second plate (s). 35
    [0003]
    3. Heat pipe according to one of claims 1 to 2, wherein the collector channel is in fluid communication with each channel of condensation (12) by means of a narrow passage (8).
    [0004]
    4. Heat pipe according to claim 3, wherein the narrow passage is arranged at the end connected (12b) to the tank of each condensation groove (12). É. Heat pipe according to one of claims 3 to 4, wherein the hydraulic diameter of the narrow passage (8) is strictly less than the hydraulic diameter of the condensation channel. 6. Heat pipe according to one of claims 3 to 5, wherein the size of the narrow passage (8) is chosen so that a meniscus of liquid (84) is formed and remains there, depending on the fluid of selected work and regardless of the orientation with respect to the gravity field, so that the capillary pressure that this meniscus generates compensates the gravity field in any direction. 7. Heat pipe according to one of claims 1 to 6, wherein the mass of fluid (5) is chosen so that the reservoir (9) is completely filled with the vapor phase (5V) at the minimum operating temperature of the heat pipe. . 8. Heat pipe according to one of claims 1 to 7, wherein the casing formed by the first plate (21), the second plate (22) and the edge (23) is made of ceramic material. 9. Heat pipe according to one of claims 1 to 8, wherein the capillary structure (3) is made of ceramic material.
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    同族专利:
    公开号 | 公开日
    WO2016058966A1|2016-04-21|
    US20170227296A1|2017-08-10|
    JP2017531154A|2017-10-19|
    CN107148547A|2017-09-08|
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    US10295269B2|2019-05-21|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US6082443A|1997-02-13|2000-07-04|The Furukawa Electric Co., Ltd.|Cooling device with heat pipe|
    DE202005008792U1|2005-06-06|2005-08-25|Klotsche, Michael E. M., Dipl.-Ing.|Over temperature protection for flat heat pipe has the outer metal foil walls loosely fitted over the porous core to lift off the core under high internal pressure|
    US20090159243A1|2007-12-19|2009-06-25|Teledyne Scientific & Imaging, Llc|Nano tube lattice wick system|
    US3613778A|1969-03-03|1971-10-19|Northrop Corp|Flat plate heat pipe with structural wicks|
    US4833567A|1986-05-30|1989-05-23|Digital Equipment Corporation|Integral heat pipe module|
    US5642776A|1996-02-27|1997-07-01|Thermacore, Inc.|Electrically insulated envelope heat pipe|
    TW540989U|2002-10-04|2003-07-01|Via Tech Inc|Thin planar heat distributor|
    US7184265B2|2003-05-29|2007-02-27|Lg Electronics Inc.|Cooling system for a portable computer|
    US20050168947A1|2003-12-11|2005-08-04|Mok Lawrence S.|Chip packaging module with active cooling mechanisms|
    TWI285251B|2005-09-15|2007-08-11|Univ Tsinghua|Flat-plate heat pipe containing channels|
    JP2009076650A|2007-09-20|2009-04-09|Sony Corp|Phase change type heat spreader, passage structure, electronic device, and method of manufacturing phase transformation type heat spreader|
    KR100912538B1|2007-12-04|2009-08-18|한국전자통신연구원|The flat plate type micro heat transport device|
    CN102440086B|2009-05-18|2015-03-25|华为技术有限公司|Heat spreading device and method therefore|
    CN102062553B|2009-11-12|2013-12-04|富准精密工业有限公司|Flat plate type heat pipe|
    CN101929813B|2010-08-24|2012-07-25|山东大学|Flat-plate heat pipe|
    FR3009376A1|2013-08-01|2015-02-06|Calyos Sa|SIMPLIFIED ASSEMBLY EVAPORATOR FOR DIPHASIC LOOP|
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    JP2019179893A|2018-03-30|2019-10-17|株式会社ケーヒン|Cooler|
    CN111542202B|2020-04-21|2021-05-14|华南理工大学|Inflation type soaking plate and manufacturing method thereof|
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    法律状态:
    2015-10-29| PLFP| Fee payment|Year of fee payment: 2 |
    2016-04-22| PLSC| Search report ready|Effective date: 20160422 |
    2016-10-27| PLFP| Fee payment|Year of fee payment: 3 |
    2017-09-25| PLFP| Fee payment|Year of fee payment: 4 |
    2018-10-26| PLFP| Fee payment|Year of fee payment: 5 |
    2019-10-25| PLFP| Fee payment|Year of fee payment: 6 |
    2020-10-26| PLFP| Fee payment|Year of fee payment: 7 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1459885|2014-10-15|
    FR1459885A|FR3027379B1|2014-10-15|2014-10-15|FLAT CALODUC WITH TANK FUNCTION|FR1459885A| FR3027379B1|2014-10-15|2014-10-15|FLAT CALODUC WITH TANK FUNCTION|
    PCT/EP2015/073505| WO2016058966A1|2014-10-15|2015-10-12|Flat heat pipe with reservoir function|
    CN201580057445.6A| CN107148547A|2014-10-15|2015-10-12|Flat-plate heat pipe with holder function|
    US15/518,707| US10295269B2|2014-10-15|2015-10-12|Flat heat pipe with reservoir function|
    JP2017519288A| JP2017531154A|2014-10-15|2015-10-12|Planar heat pipe with storage function|
    EP15777702.0A| EP3207324B1|2014-10-15|2015-10-12|Flat heat pipe with reservoir function|
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